What are the characteristics of the three common packaging processes for LED displays?
Date: 2019-12-10
Following the direct-in-line (Lamp) process, the LED display industry has widely transitioned to the surface-mount (SMD) process. With the popularity of surface-mount (SMD), COB packaging has been vacated when it has largely replaced the direct-in-line.
In fact, the comparison between COB and surface mount is originally a bit of "Gong Gong and Qin Qiong", and the relationship between the "surface mount" process of small-pitch LED screens and COB is not a "direct competition" relationship. COB is a packaging technology, and SMD surface mount is a large number of tiny device structural layouts and electrical connection technologies. They are at different stages of the electronics industry, especially the LED industry. In other words, Jinghui surface mount is the core technology of LED screen manufacturers, and packaging technologies such as COB are the "work" of the LED manufacturer industry, an upstream company of terminal manufacturers. There is no need to directly compare the two, but they cannot stand the current LED small-pitch fire. In order to achieve the solution of LED small-pitch display, everyone is crossing the sea at the Eight Immortals and showing their magic.
What is the difference between the advantages and disadvantages of the three types of inline packaging, SMD, and COB? In the competition of the small-pitch manufacturing process, many small-pitch manufacturers can only passively focus on the "reflow soldering surface mount process" and other links. However, with the continuous development of small pitches, the LED lamp beads needed to be patched within a unit area have multiplied geometrically, which has put higher and higher requirements on surface mount technology. Affected by the smaller the small-pitch pitch, the greater the difficulty of this dense mounting process, the small-pitch LED display has continued to reduce the pitch while the problem of too high a dead lamp rate has not been effectively solved.
The COB (chip-on-board) technology adheres the LED bare chip to the PCB substrate with conductive or non-conductive silver glue, and then performs wire bonding to achieve its electrical connection. Compared with traditional SMD LED packages, COB packages have advantages in terms of manufacturing efficiency, low thermal resistance, light quality, application, cost, etc., especially in small-pitch display products with a pitch of less than 1.25mm, which has a large comprehensive advantage. Jinghui COB packaging is basically the same as the traditional SMD production process in terms of production process. It is basically equivalent to SMD packaging efficiency in die bonding and wire bonding processes. However, COB packaging is more efficient than SMD in dispensing, separation, beam splitting, and packaging. Products are much higher. Traditional SMD packaging labor and manufacturing costs account for about 15% of material costs, and COB packaging labor and manufacturing costs account for about 10% of material costs. With COB packaging, labor and manufacturing costs can be saved by 5%.
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